ENSURE 8310 series  
 

As companies continue to introduce compact products with ever decreasing sizes and profiles, this miniaturisation trend introduces delicate components and restricts the use of mechanical assembling methods. ENSURE 8310 series are formulated for structural bonding of such intricate and delicate components. ENSURE 8310 series possess excellent dimensional stability and cured with very low shrinkage to protect assemblies from strain and stress during service, moisture and thermal exposure. ENSURE 8310 series are formulated for stability at room temperature while curable at low temperature. ENSURE 8310 series are best suited for bonding and encapsulating of miniature components, assemblies and housing prevalent used for portable consumer electronics such as music players, mobile phones, digital camera, external hard drives, smart cards, miniature speakers, etc and engineering products such as compact sensors and encoders, miniature vibration motors, piezoelectric sensors, etc

 
 
Key Characteristics & Features  
 

CURING SYSTEM
- Primary system: Heat curing

KEY SUBSTRATES
- Key substrates: Plastics
- Secondary substrates: Glass, metals & ceramics

RESPONSIVE & CONSISTENT CURING
- Allow consistent curing of bonding area with varying depth
- Suited for temperature sensitive components with onset of curing at low temperature
- Permit assembly of components with shaded bonding area

EXCELLENT DIMENSIONAL STABILITY
- Possess low shrinkage, high modulus, high glass transition temperature & low coefficient of
   thermal expansion
- Protect intricate & delicate assembly from stresses due to CTE mismatch & thermal cycling
- Permit assembling of dissimilar materials

EXCELLCENT SERVICE TEMPERATURE
- Enhance resistance & reliability of assembly against high temperature & temperature cycling
- Protect against higher reflow temperature for lead free soldering

LOW MOISTURE ABSORPTION
- Enhance resistance & reliability of assembly against humidity
- Permit service under demanding environmental conditions

 
 
Typical Applications  
 
- Bonding, sealing & tacking of plastics such as polycarbonate, polyamide, PET, ABS, acrylic, polystyrene, PVC, to plastics & other substrates such as glass, metals & ceramics
- Bonding of miniature & delicate components & devices onto housings, chassis & frames where parts of the bonding area are shaded from ultraviolet exposure
- Mounting for mechanical assemblies
- Rapid fixturing & tacking of components after alignment or partial assembly
 
 
Series Classification  
 

 Available Grades

 Flow

 Viscosity

 ENSURE EN-8311

 Liquid

 5,000 - 6,000 cP

 ENSURE EN-8312

 Viscous liquid

 14,500 - 15,500 cP

 ENSURE EN-8313

 Semi- paste

 20,000 - 22,000 cP

 
 
Typical Material Properties  
 

Base

Epoxy

Appearance

Clear / Amber & fluorescent

Curing

125ºC for 10 minutes

Reflective Index

1.51

Hardness, Shore D

88

Elongation @ break, %

2

Shrinkage, %

<0.5

Tensile Strength, MPa (PSI)

25.9-27.6 (3,750-4,000)

Modulus, MPa (PSI)

1,724-1,896 (250,000-275,000)

Shear Strength (Steel/Steel), MPa (PSI)

27.6 (2,000)

Moisture adsorption @ 85% RH & 85 ºC, % Weight

<0.8

Glass transition temperature (Tg), ºC

110

Coefficient of thermal expansion (CTE), ppm/ºC

 

      a) CTE1 before Tg

35

      b) CTE2 before Tg

50

Service Temperature, ºC

-40 to 200

 
 
Material Selection  
 

ENSURE  EN-8311: Liquid, 5,000-6,000 cP





ENSURE  EN-8312: Viscous liquid, 14,500-15,500 cP Thixo





ENSURE  EN-8313: Semi-paste, 20,000-22,000 cP Thixo





 
 
 
Products  
ENSURE 8310 series
Key characteristics & features
Typical applications
Series Classification
Typical material properties
Material Selection