ENSURE 8320 - 8350 series  
 

Electronics has become an essential part of most devices, equipment and machinery. ENSURE 8320 - 8350 series are developed for assembly and protection applications of electronics components and circuitry. ENSURE 8320 - 8350 series are formulated to be lead free and are RoHS compliance. ENSURE 8320 - 8350 series has excellent stability at room temperature while being curable at low temperature. ENSURE 8320 - 8350 series cured with excellent adhesion, very low shrinkage, highly insulative and excellent dimensional stability. ENSURE 8320 - 8350 series are formulated for high resistance to mechanical damage, chemicals, solvents, moisture and temperature. ENSURE 8320 - 8350 series are best suited to protect packages assemblies from strain and stress during 260°C non lead reflow temperature and JEDEC level of service & moisture.

 
 
Key Characteristics & Features  
 

CURING SYSTEM
− Primary system: Heat curing

KEY SUBSTRATES
- Key substrates: Plastics
- Secondary substrates: Glass, metals & ceramics

RESPONSIVE & CONSISTENT CURING
− Allow consistent curing of bonding area with varying depth
− Suited for temperature sensitive components with onset of curing at low temperature
− Permit assembly of components with shaded bonding area

EXCELLENT DIMENSIONAL STABILITY
− Possess low shrinkage, high modulus, high glass transition temperature & low coefficient of
   thermal expansion
− Protect intricate & delicate assembly from stresses due to CTE mismatch & thermal cycling
− Permit assembling of dissimilar materials

EXCELLCENT SERVICE TEMPERATURE
− Enhance resistance & reliability of assembly against high temperature & temperature cycling
− Protect against higher reflow temperature for lead free soldering

LOW MOISTURE ABSORPTION
− Enhance resistance & reliability of assembly against humidity
− Permit service under demanding environmental conditions

 
 
Typical Applications  
 
- Underfilling of flip chips, chip scale package, ball grid arrays, etc on laminate, ceramic and flexible substrates
- Glob top encapsulating of chip on board, ball grid arrays, integrated circuit, hybrid circuit, etc
- Fill encapsulating of cavity ball grid arrays, fine pitch wire leads, large array packages, modules, sensors etc
- Dam and fill encapsulating for bare chips encapsulations, low profile packages, ceramic or large array packages, etc
 
 
Series Classification  
 

 Available Grades

 Flow

 Viscosity

 ENSURE EN-8320

 Self leveling liquid

 2,000 - 3,000 cP

 ENSURE EN-8325

 Self leveling liquid

 4,000 - 6,000 cP

 ENSURE EN-8330

 Liquid

 14,900 - 16,100 cP

 ENSURE EN-8340

 Viscous liquid

 28,000 - 29,000 cP

 ENSURE EN-8350

 Non slag paste

 40,000 - 42,000 cP

 
 
Typical Material Properties  
 

EN-8320

 

Function

BGA & CSP Underfill

Appearance

White

Classification

Self leveling liquid

Curing

125ºC for 15 minutes

Viscosity @ 25ºC, cP

2,000 - 3,000

Hardness, Shore D

85

Tensile Strength, MPa (PSI)

48.3-103.4 (7,000 -15,000)

Modulus, MPa (PSI)

1,379-1,896 (250,00-275,000)

Glass transition temperature (Tg), ºC

85

Coefficient of thermal expansion (CTE), ppm/ºC

 

 a) CTE1 before Tg

55

 b) CTE2 before Tg

110

Service Temperature, ºC

-40 to 180

 

 

EN-8325

 

Function

Flip chip Underfill

Appearance

Black

Classification

Self leveling liquid

Curing

125ºC for 15 minutes

Viscosity @ 25ºC, cP

4,000-6,000

Hardness, Shore D

88

Tensile Strength, MPa (PSI)

25.9-27.6 (3,750-4,000)

Modulus, MPa (PSI)

1,724-1,896 (250,000-275,000)

Glass transition temperature (Tg), ºC

120

Coefficient of thermal expansion (CTE), ppm/ºC

 

 a) CTE1 before Tg

35

 b) CTE2 before Tg

50

Service Temperature, ºC

-40 to 200

 

 

EN-8330

 

Function

Fill encapsulation

Appearance

Black

Classification

Liquid

Curing

125ºC for 15 minutes

Viscosity @ 25ºC, cP

14,900 - 16,100

Hardness, Shore D

88

Tensile Strength, MPa (PSI)

25.9-27.6 (3,750-4,000)

Modulus, MPa (PSI)

1,724-1,896 (250,000-275,000)

Glass transition temperature (Tg), ºC

120

Coefficient of thermal expansion (CTE), ppm/ºC

 

 a) CTE1 before Tg

35

 b) CTE2 before Tg

50

Service Temperature, ºC

-40 to 200

 

 

EN-8340

 

Function

Globtop encapsulation

Appearance

Black

Classification

Viscous liquid

Curing

125ºC for 15 minutes

Viscosity @ 25ºC, cP

28,000 - 29,000

Hardness, Shore D

88

Tensile Strength, MPa (PSI)

25.9-27.6 (3,750-4,000)

Modulus, MPa (PSI)

1,724-1,896 (250,000-275,000)

Glass transition temperature (Tg), ºC

120

Coefficient of thermal expansion (CTE), ppm/ºC

 

 a) CTE1 before Tg

35

 b) CTE2 before Tg

50

Service Temperature, ºC

-40 to 200

 

 

EN-8350

 

Function

Dam encapsulation

Appearance

Black

Classification

Non slag paste

Curing

125ºC for 15 minutes

Viscosity @ 25ºC, cP

40,000 - 42,000

Hardness, Shore D

88

Tensile Strength, MPa (PSI)

25.9-27.6 (3,750-4,000)

Modulus, MPa (PSI)

1,724-1,896 (250,000-275,000)

Glass transition temperature (Tg), ºC

120

Coefficient of thermal expansion (CTE), ppm/ºC

 

 a) CTE1 before Tg

35

 b) CTE2 before Tg

50

Service Temperature, ºC

-40 to 200

 
 
Material Selection  
 

ENSURE  EN-8320 & EN-8325: Self leveling liquid, 2,000-6,000 cP





ENSURE  EN-8330: Liquid, 14,900-16,100 cP





ENSURE  EN-8340: Viscous liquid, 28,000-29,000 cP Thixo





ENSURE  EN-8350: Non slag paste, 40,000-42,000 cP Thixo





 
 
 
Products  
ENSURE 8320 - 8350 series
Key characteristics & features
Typical applications
Series Classification
Typical material properties
Material Selection