SECURE 8260 series  
 

As companies continue to introduce compact products with ever decreasing sizes and profiles, this miniaturisation trend introduces delicate components and restricts the use of mechanical assembly. SECURE 8260 series are formulated for structural bonding of such intricate and delicate components. SECURE 8260 series possess excellent dimensional stability to protect such assemblies from strain and stress during service, moisture and thermal exposure. SECURE 8260 series are best suited for bonding and encapsulating of miniature components, assemblies and housing prevalent used for portable consumer electronics such as music players, mobile phones, digital camera, external hard drives, smart cards, miniature speakers, etc and engineering products such as compact sensors and encoders, miniature vibration motors, piezoelectric sensors, actuators, etc.

 
 
Key Characteristics & Features  
 

CURING SYSTEM
- Primary system: Ultraviolet light & heat curing

KEY SUBSTRATES
- Key substrates: Plastics
- Secondary substrates: Glass & metals

VERSATILE CURING
- Increase options for assembly designs & production sequence
- Faster assembly or alignment with rapid ultraviolet fixturing
- Adhesives in shaded area can be heat cure to improve bonding strength

EXCELLENT DIMENSIONAL STABILITY
- Possess low shrinkage, high modulus, high glass transition temperature & low coefficient of
   thermal expansion
- Protect intricate & delicate assembly from stresses due to CTE mismatch & thermal cycling
- Permit assembling of dissimilar materials

HIGH SERVICE TEMPERATURE
- Enhance resistance & reliability of assembly against high temperatures & temperature cycling
- Protect against higher reflow temperature profile of lead free solder

LOW MOISTURE ABSORPTION
- Enhance resistance & reliability of assembly against humidity
- Permit service under demanding environmental conditions

 
 
Typical Applications  
 
- Bonding, sealing & tacking of plastics such as polycarbonate, polyamide, PET, ABS, acrylic, polystyrene, PVC, to plastics & other substrates such as glass, metals & ceramics
- Bonding of miniature components & devices onto housings, chassis & frames
- Mounting for mechanical assemblies
- Rapid fixturing & tacking of components after alignment or partial assembly
 
 
Series Classification  
 

 Available Grades

 Flow

 Viscosity

 SECURE SE-8261

 Liquid

 1,600 - 1,800 cP

 SECURE SE-8262

 Viscous liquid

 9,300 - 10,200 cP

 SECURE SE-8263

 Semi- paste

 15,700 - 16,700 cP

 
 
Typical Material Properties  
 

Base

Epoxy

Appearance

Amber

Curing

2,000 mJ/cm2 of UV-A or 125ºC for 10 minutes

Reflective Index

1.51

Hardness, Shore D

88

Elongation @ break, %

2

Shrinkage, %

<1.0

Tensile Strength, MPa (PSI)

25.9-27.6 (3,750-4,000)

Modulus, MPa (PSI)

1,724-1,896 (250,000-275,000)

Shear Strength (PET/PET), MPa (PSI)

10.3 (1,500)

Glass transition temperature (Tg), oC

140

Coefficient of thermal expansion (CTE), ppm/oC

 

      a) CTE1 before Tg

42

      b) CTE2 before Tg

60

Service Temperature, ºC

-40 to 200

 
 
Material Selection  
 

SECURE  SE-8261: Liquid, 1,600-1,800 cP





SECURE  SE-8262: Viscous liquid, 9,300-10,200 cP Thixo





SECURE  SE-8263: Semi-paste, 15,700-16,700 cP Thixo





 
 
 
Products  
SECURE 8260 series
Key characteristics & features
Typical applications
Series Classification
Typical material properties
Material Selection