Key Features

- Excellent adhesion on difficult to bond substrates such as LCP, PBT, PPS, PC, PA, PI, FR4, FPC, glass, ceramic, etc
- Precise and stable dispensing with tiny orifice needles up to Gauge 32
- Higher throughout and very fast assemble times as short as a second with rapid UV curing response
- Minimise concerns with low-temperature curing as low as 70°C
- Reliable performance and resistance under various ageing conditions such as humidity, thermal cycling, impact drop testing
- Low stress, low warpage, low outgassing options for specific requirements
- Stable adhesion and flexibility at very low temperatures of up to -40°C
- Hybrid UV and thermal curing for bonding geometry complex assemblies

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