Key Features
Camera Modules
Camera Modules
As the camera modules in our smart devices continue to develop their imaging capabilities, the assembly of miniaturised components grew tandemly in complexity, placing stringent expectations on the performance of the bonding adhesives. As a result, Fotopolymer has developed a range of speciality adhesives to address the requirements of various assemblies within the camera module.
- Excellent adhesion on difficult to bond substrates such as LCP, PBT, PPS, PC, PA, PI, FR4, FPC, glass, ceramic, etc
- Precise and stable dispensing with tiny orifice needles up to Gauge 32
- Higher throughout and very fast assemble times as short as a second with rapid UV curing response
- Minimise concerns with low-temperature curing as low as 70°C
- Reliable performance and resistance under various ageing conditions such as humidity, thermal cycling, impact drop testing
- Low stress, low warpage, low outgassing options for specific requirements
- Stable adhesion and flexibility at very low temperatures of up to -40°C
- Hybrid UV and thermal curing for bonding geometry complex assemblies
