Electronic devices have drastically transformed the way we live our lives, from computers to smartphones. This transformation continues to shape our future with the increasing use of Internet of Things devices in our homes and the broader application of electronics in our vehicles. To ensure the long-term reliability of these devices, the need to protect delicate electronic circuitry and components from mechanical stresses and harsh environments. Fotopolymer underfills, encapsulants, and conformal coating compounds improve the structural integrity and durability of the electronic assemblies against mechanical impacts, thermal shock and corrosive exposures.